This seminar provides an opportunity to hear four talks before they are presented at the upcoming 2019 International Imaging Sensors Workshop, to be held in Snowbird, USA at the end of June. The speakers are looking for critical feedback to help improve their slides and delivery, so please come along to help out. The order of talks and speakers will be as follows:
1kFPS Time-of-Flighy Imaging with a 3D-stacked CMOS SPAD Sensor, Istvan Gyongy
This paper presents initial 3D imaging results from a direct Time of Flight SPAD image sensor with in-pixel photon processing, that can operate at frame rates exceeding 1kFPS.
Energy Harvesting Pixel Array with Deep Trench Isolated Diodes for Self-Powered Imaging, Filip Kaklin
An array of pixels with dual functionality (imaging / energy harvesing) is implemented in a deep trench isolation (DTI) backside illuminated (BSI) process.
A Reconfigurable 40nm CMOS SPAD Array for LiDAR Receiver Validation, Sarah Patanwala
A reconfigurable single photon avalanche diode (SPAD) array realised in 40nm CMOS technology interfaced to a Xilinx Kintex-7 FPGA, providing the capability to readout 128 channels at 100MHz simultaneously.
Dual Layer 3D-Stacked High Dynamic Range SPAD Pixel, Robert Henderson
A dual layer single photon avalanche diode (SPAD) pixel implemented in a 3D-stacked CMOS technology is presented. Two SPAD devices arranged vertically such that the backside illuminated (BSI) top diode and the front side illuminated (FSI) bottom diode form a single pixel unit.
Pizza will be served following the talks.